Everything you purchase today that is electronic uses circuit boards to keep them running. How these circuit boards are made demands use of complicated specialty equipment designed specifically for making the components for tablets, smart phones and virtually every other electronic devise available. One of the machines needed to create these mobile connections and ensure they work is the reflow soldering oven.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The beginning zone is called a preheat period. As the name implies it serves to find the proper temperature needed to complete the task. The ramp up rate is important because if the temperature is too hot or too cold it will create problems with the finished product. When the heat rises too fast or too high it can cause solder to crack or spatter and too low or slow can create problems with the melting process of solder leaving it dull or brittle.
A thermal soak zone is next in the process. This soak usually lasts no longer than two minutes and is designed to remove paste volatiles and activate the flux components to begin oxide reduction on leads and pads of circuits. Again the temperature must be precise to prevent spattering or balling of solder from heat that is too high. When the soak is complete a thermal assessment of the entire board is required before it moves to the next zone.
The third step in the process is called the reflow zone. It is also referred to as the time above liquidus or TAL and is the point of highest heat in this process. Operators must monitor the temperature closely in this zone because if it surpasses the level of heat that can be tolerated by the weakest component thermal damage will occur. The entire process lasts about a minute and the solder becomes liquid and "reflows".
The final step is the cooling zone. This is a slow process that gradually cools the board and causes the liquid solder to become solid. When done properly it can help to prevent excess thermal shock to the boards and their components. Many companies pay little attention to the cool down rate because it is less critical than the ramp up rate but a cooling rate of four degrees Celsius per second is recommended.
Most equipment used in this process allows the operator to see what is happening inside the closed unit. Some are equipped with viewing windows and others can be attached to a screen using a USB connection. This viewing allows the operator to adjust the temperatures while monitoring the progress of each board.
These ovens make it possible for you to enjoy the technical electrical gadgets that make life easier. As the technology advances they will become more streamlined and advanced to keep pace.
This machine is used to permanently solder two flat components together. The process uses a powdered solder mixture that is placed at critical locations on the board and circuits to be soldered. The prepared board is then heated to the point of melting the solder to permanently affix the two components together. There are four stages in conventional processing typically called zones.
The beginning zone is called a preheat period. As the name implies it serves to find the proper temperature needed to complete the task. The ramp up rate is important because if the temperature is too hot or too cold it will create problems with the finished product. When the heat rises too fast or too high it can cause solder to crack or spatter and too low or slow can create problems with the melting process of solder leaving it dull or brittle.
A thermal soak zone is next in the process. This soak usually lasts no longer than two minutes and is designed to remove paste volatiles and activate the flux components to begin oxide reduction on leads and pads of circuits. Again the temperature must be precise to prevent spattering or balling of solder from heat that is too high. When the soak is complete a thermal assessment of the entire board is required before it moves to the next zone.
The third step in the process is called the reflow zone. It is also referred to as the time above liquidus or TAL and is the point of highest heat in this process. Operators must monitor the temperature closely in this zone because if it surpasses the level of heat that can be tolerated by the weakest component thermal damage will occur. The entire process lasts about a minute and the solder becomes liquid and "reflows".
The final step is the cooling zone. This is a slow process that gradually cools the board and causes the liquid solder to become solid. When done properly it can help to prevent excess thermal shock to the boards and their components. Many companies pay little attention to the cool down rate because it is less critical than the ramp up rate but a cooling rate of four degrees Celsius per second is recommended.
Most equipment used in this process allows the operator to see what is happening inside the closed unit. Some are equipped with viewing windows and others can be attached to a screen using a USB connection. This viewing allows the operator to adjust the temperatures while monitoring the progress of each board.
These ovens make it possible for you to enjoy the technical electrical gadgets that make life easier. As the technology advances they will become more streamlined and advanced to keep pace.
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